Air-cooled, heat pipe and liquid-cooled heat sinks for IGBT, thyristor and SiC modules; IsoMAXX vacuum-brazed cold plates, thermal design, simulation and testing services.
Power Electronics Cooling Solutions
Mersen helps you maximize the performance, safety and reliability of your power electronics with customized cooling solutions, engineering services and support. Mastering air, phase-change (heat pipe) and liquid cooling, Mersen offers custom designs that can be adapted to almost any application in any industry.
From design to production: support from the earliest stage of identifying needs through prototype, production and logistics. Wind tunnel test lab, prototype and production quality assurance, close collaboration at design stage, test data and reports.
R-TOOLS MAXX: a free online selection tool that simulates the optimum air or liquid-cooled heat sink before a prototype is built.
Manufacturing centres: La Mure (France) — liquid cooling; Rochester, NY (USA) — air cooling and heat pipes; Shanghai (China) — air and liquid cooling.
- Air-cooled heat sinks — extruded, bonded-fin and forced air
- Liquid-cooled solutions — vacuum-brazed aluminium and copper-nickel cold plates
- IsoMAXX — enhanced cold plate for IGBT modules
- Heat pipe assemblies — cold wall systems
- Press-pack heat sinks — for thyristor and diode stacks
- Battery thermal management
- Heat frames and chassis
Technical Specifications
| Cooling technologies | Air, phase change (heat pipe), liquid |
|---|---|
| Services | Thermal design, simulation, prototype, testing, series production |
| Quality | ISO 9001, AS9100D |
| Compliance | RoHS |
Cooling of Power Electronics Guide (PDF) Heat Sinks for High-Power Applications (PDF) IsoMAXX Cold Plates Flyer (PDF) Heat Pipes Flyer (PDF) Manufacturer Product Page